Welcome to the Flexible Electronics and Additive Printing (FEAP) Laboratory!
The FEAP lab specializes in research areas including micro/nano scale fabrication, novel additive manufacturing processes, rapid prototyping methods and tools, and manufacturing systems based on inkjet printing and laser ablation for flexible electronics and optoelectronics. The research includes but not limited to scaffolds fabrication for biomedical applications, laser ablation, real-time monitoring and automation, CAD/CAM systems, 3D printing, topography optimization, multi-material and multi-scale fabrication based on additive printing.
If you have any questions or collaboration requests regarding to 3D printing or additive manufacturing, feel free to contact Dr. Qin at hqin52@wisc.edu.
Click the links here or the “Menu” (top-side toolbar if on a mobile device) to learn more about our news, honors/awards, projects, publications, teaching, service, and group members.
The research labs are located in two buildings: (1) 219 Engineering Research Building, and (2) 3026 Mechanical Engineering Building, 1513 University Ave., University of Wisconsin – Madison, WI 53706.
Find out more about the Department of Industrial & Systems Engineering:
Principle Investigator: Hantang Qin, Ph.D.
Office: 3222 Mechanical Engineering Building, 1513 University Ave., UW-Madison, WI 53706
Office phone: 608-890-3780
Email: hqin52@wisc.edu